1. 학술대회명: IEEE Electronic Components and Technology Conference
2. 논문명: 3D Coupled Line Inductors with Through-Glass Vias for Compact Passive Circuit Integration in Glass Packages
3. 저자명: 김소정, 진강태; 김영준, 권희수(KETI); 김유빈(KETI); 육종민(KETI); 유제인(KETI)
4. 출간 일자: 2025.05.30